PRINTED CIRCUIT BOARD HAVING STRUCTURE FOR SOLDERING PASSIVE ELEMENT, PCB CARD USING THE PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A PCB(Printed Circuit Board) having a structure for soldering a passive element, a PCB card using the PCB and a method for manufacturing the same are provided to mount the passive element without using an SR(Solder Resist) film or ink. A PCB(100) having a structure for soldering a passive element includes an insulating member(120), at least one contact unit(130), and a circuit pattern(140). At least one contact unit exposes one surface thereof to a region of the insulating member. The circuit pattern is formed on the other surface of the insulating member partially and electrically connected to the contact unit and forms an oxidation region in a region except a mounting region of the element. The contact unit and the circuit pattern are electrically connected to each other by a via.