HEAT SPREADER MODULE, METHOD FOR MANUFACTURING THE HEAT SPREADER MODULE, AND HEAT SINK

摘要

A heat spreader module ((10) is provided with first and second intermediate boards (14, 20) on the both surfaces of an insulating board (12). The intermediate boards (14, 20) are formed by covering the entire surfaces of stress relaxing boards (16, 22), which have a Young's modulus smaller than that of the insulating board (12), with metal films (18, 24), respectively. Thus, when a semiconductor device (36) generates heat, since the intermediate boards (14, 20) have the Yong's modulus smaller than the young's modulus of the insulating board (12), the generated stress is relaxed by the intermediate boards (14, 20).