SOLDER SHEET AND POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a solder sheet capable of increasing the thickness of a solder layer formed between two opposing surfaces and uniforming the thickness of the solder layer, and to provide a power module having a thick and uniform solder layer on at least one side of an insulating circuit substrate by using the solder sheet.

SOLUTION: The solder sheet 1 is arranged between first and second surfaces and melted to form a solder junction layer between the first and second surfaces. Spacer particles 5 are provided to hold the first and second surfaces with the solder junction layer therebetween at a predetermined spacing. The spacer particles 5 are dispersed along the surface of the sheet and formed of a material having the melting point higher than that of the solder forming the solder junction layer.

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