| 摘要 |
PROBLEM TO BE SOLVED: To control a molten brazing material not to ride on the surface to which a semiconductor chip is bonded along the side face of a circuit layer when the circuit layer is brazed to the surface of a ceramic board. SOLUTION: A brazing material layer 20 interposed between a laminate 14a of a ceramic board 11 and a circuit layer 12 has an outer circumferential part 20a where the outer circumferential edge of the circuit layer 12 is arranged on the surface, and an inside part 20b surrounded by the outer circumferential part 20a in the laminate 14a. The inside part 20b is formed of a brazing material of ultrafine particle powder having a diameter of 0.1μm or less, and the outer circumferential part 20a is formed of a brazing material having a particle size larger than that of the brazing material of the inside part 20b, or of a brazing material foil. COPYRIGHT: (C)2008,JPO&INPIT |
