| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface acoustic wave device having a hollow structure which does not deform by pressure applied during module configuring without lowering the yield. SOLUTION: The present invention relates to the surface acoustic wave device comprising an elastic wave element 12 provided on a piezoelectric substrate 10, a first sealing portion 26 provided on the piezoelectric substrate 10 to have a cavity portion 16 on the elastic wave element 12, and a second sealing portion 28 provided on the first sealing portion 26, which has a step such that a width t2 on the side of the piezoelectric substrate 10 is wider than a width t3 on the opposite side from the piezoelectric substrate 10. COPYRIGHT: (C)2008,JPO&INPIT
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