| 摘要 |
PROBLEM TO BE SOLVED: To prevent unwanted solder adhesion to a wiring board except a portion to be soldered without causing deterioration in working performance. SOLUTION: The wiring board 1 includes conductor layers 7 on both sides of a substrate core 5, and resist layers 9 as insulating layers on both the surfaces thereof, respectively, wherein lead terminals 11 of an electric component 3 are connected to a land portion 13 as electrodes of the conductor layers 7 exposed on an opening of the resist layer 9 via a solder 15. A large number of fine convex portions 21 are formed as an uneven portion 19 by the same method as that for the resist layer 9 or integrally formed in forming the resist layer 9 on the resist layer 9 near a connection portion 17 using this solder 15. COPYRIGHT: (C)2008,JPO&INPIT
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