发明名称 |
COOLING APPARATUS WITH SURFACE ENHANCEMENT BOILING HEAT TRANSFER |
摘要 |
A cooling apparatus boiling and condensing liquid coolant has a vessel including a microporous surface enhancement coating applied on a thermally-conductive plate which is fully immersed under the liquid coolant in the vessel. The surface enhancement coating augments significantly a nucleate boiling heat transfer and critical heat flux when receiving heat from a heating object coupled to the thermally-conductive plate at a surface outside of the vessel. One embodiment of this invention including a vessel with a height/length dimension less than 300mm, a microporous coating with nickel particles of 30-50µm in size bonded by a thermally-conductive binder, and water as the liquid coolant, without complicated radiator component, is used for cooling a heating electronics element. |
申请公布号 |
WO2007115270(A3) |
申请公布日期 |
2008.08.07 |
申请号 |
WO2007US65806 |
申请日期 |
2007.04.02 |
申请人 |
VAPRO, INC.;KIM, JESSE;YOU, SEUNG MUN |
发明人 |
KIM, JESSE;YOU, SEUNG MUN |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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