| 摘要 |
PROBLEM TO BE SOLVED: To provide a new polybutadiene thermosetting resin circuit board composition by improving the electrical properties, chemical properties, and heat-resistance properties of a circuit board generated with polybutadiene as a main material, namely improving the heat-resistance properties of polybutadiene, thermal expansion coefficient, dielectric coefficient, wear factor, viscosity, junction strength, and the like, and reducing manufacturing costs, and to provide a method of manufacturing the polybutadiene thermosetting resin circuit board composition. SOLUTION: The circuit board composition comprises: a mixture of a high molecular weight polybutadiene thermosetting resin having a molar mass of≥100,000 g/mol containing≥70 wt.% vinyl group and a low molecular weight polybutadiene thermosetting resin having a molar mass of 5,000 to 10,000 g/mol; a thermosetting resin base material, comprising two or more vinyl group double-bond cyclolefine compounds and/or a high molecular weight polymer where acrylic acid, acrylic acid nitrile, and butadiene are subjected to a polymerization reaction; a glass fiber cloth; an inorganic particle filler; a metallic coagent; and a bromine flame retarder. COPYRIGHT: (C)2008,JPO&INPIT
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