| 摘要 |
PROBLEM TO BE SOLVED: To provide a device for processing and observing a microscopic sample and a method for processing and observing the same, whereby the cross-sectional observation and analysis of a wafer cross-section can be performed with high resolution, high precision and high throughput from various directions from horizontality to verticality without breaking a wafer used as a sample. SOLUTION: This device includes a focus ion beam optical system and an electron optical system in the same vacuum device, and also includes a probe for separating the microscopic sample containing the desired region of the sample by a charged particle beam type molding process to take out the separated microscopic sample. COPYRIGHT: (C)2008,JPO&INPIT
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