A probe array wafer (20) includes a substrate (24) upon which a plurality of compliant probes (22, 28, 30) are mounted. Pairs of axially aligned probes (28) may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes (28) may be electrically connected together to probe a ground connection from the test equipment to the device under test.
申请公布号
WO2008042520(A3)
申请公布日期
2008.08.07
申请号
WO2007US76841
申请日期
2007.08.27
申请人
INTERCONNECT DEVICES, INC.;BOGATIN, ERIC L.;HENRY, DAVID W.;MARX, DONALD A.