发明名称 PROBE ARRAY WAFER
摘要 A probe array wafer (20) includes a substrate (24) upon which a plurality of compliant probes (22, 28, 30) are mounted. Pairs of axially aligned probes (28) may be electrically connected together to provide a pass through power connection from the test equipment to the device under test. Likewise, pairs of axially aligned probes (28) may be electrically connected together to probe a ground connection from the test equipment to the device under test.
申请公布号 WO2008042520(A3) 申请公布日期 2008.08.07
申请号 WO2007US76841 申请日期 2007.08.27
申请人 INTERCONNECT DEVICES, INC.;BOGATIN, ERIC L.;HENRY, DAVID W.;MARX, DONALD A. 发明人 BOGATIN, ERIC L.;HENRY, DAVID W.;MARX, DONALD A.
分类号 G01R31/02 主分类号 G01R31/02
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