| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board processing machine for performing processing work, such as cutting a surface layer of a wiring board, cutting off a circuit pattern, and grinding the surface, with high precision in the optimum working method. SOLUTION: There are provided: processing tools 11, 12 having conductive property for cutting the surface of the wiring board 1, cutting off a circuit pattern 3 formed on a wiring board 1, and grinding the surface of a circuit pattern 3; a rotating means 15 for rotating the processing tool 11; a moving means 17 for moving the processing tool 12 reciprocally along an extending direction of the circuit pattern 3; a contact terminal 10, which consists of conductor to be in contact with the circuit pattern 3; an electric conduction detection means 19 for detecting conduction and non-conduction between the contact terminal 10 and the processing tools 11, 12; and a process selecting switch 7 for selecting manual or automatic process for cutting and polishing individually. COPYRIGHT: (C)2008,JPO&INPIT
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