| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology which can control a crack of a package at the time of soldering reflow in a semiconductor device having a resin-sealed package. <P>SOLUTION: A corner portion of a rectangular hole 10 formed in a die pad 3 is changed by using a curve line with a predetermined radius of curvature, such as a radius of curvature of 0.3 mm or more. In this way, void generated in a mould process escapes easily, so the void, which remains in resin, decreases as compared with a case, where the corner has a right angle. At the same time, extrusion of die-bonding material at a corner region of the die pad 3 is eliminated and a clearance is formed between the semiconductor chip and the die pad 3 to allow the generated void to enter the clearance. <P>COPYRIGHT: (C)2008,JPO&INPIT |
