| 摘要 |
A system for separating ICs, including a controller, a fixture and a support material supply. The fixture is coupled to a stretchable substrate and the stretchable substrate has a diced semiconductor wafer secured thereto. The diced semiconductor wafer including the plurality of ICs. The fixture being capable of stretching the stretchable substrate so as to form a corresponding plurality of spaces between each of the plurality of ICs.
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