发明名称 PHOTOSENSITIVE RESIN COMPOSITION AND RESIST PATTERN FORMING METHOD USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of suppressing occurrence of defects and forming a resist pattern of a good profile, and a resist pattern forming method using the same. <P>SOLUTION: The photosensitive resin composition comprises (a) a polyfunctional epoxy resin and (b) a cationic polymerization initiator, wherein the concentration of propylene carbonate in the photosensitive resin composition is &le;10 mass%. The photosensitive resin composition is capable of suppressing the occurrence of defects and forming a resist pattern of a good profile. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008180879(A) 申请公布日期 2008.08.07
申请号 JP20070013800 申请日期 2007.01.24
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SENZAKI TAKAHIRO;MISUMI KOICHI;YAMANOUCHI ATSUSHI;SAITO KOJI
分类号 G03F7/004;G03F7/038;H01L21/027 主分类号 G03F7/004
代理机构 代理人
主权项
地址