| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plasma treating apparatus capable of controlling conductance without exchanging a partition board. <P>SOLUTION: The plasma treating apparatus comprises: a treatment vessel, having a generation chamber for generating plasma and a treatment chamber where a substrate to be treated is arranged; and the partition board 111 that is installed so that it partitions the generation chamber from the treatment chamber and has a through hole for passing gas for treatment. The plasma treating apparatus also has a temperature adjustment means for adjusting the temperature of the partition board. <P>COPYRIGHT: (C)2008,JPO&INPIT |
