| 发明名称 |
MULTI-CHIP PACKAGE SYSTEM WITH MULTIPLE SUBSTRATES |
| 摘要 |
A multi-chip package system is provided including providing a first carrier having a first integrated circuit die thereover, providing a second carrier, placing the first carrier coplanar with the second carrier, and molding a package encapsulation around and exposing the first carrier.
|
| 申请公布号 |
US2008185702(A1) |
申请公布日期 |
2008.08.07 |
| 申请号 |
US20070672164 |
申请日期 |
2007.02.07 |
| 申请人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;TAY LIONEL CHIEN HUI;TRASPORTO ARNEL |
发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;TAY LIONEL CHIEN HUI;TRASPORTO ARNEL |
| 分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
