发明名称 Advanced MRAM design
摘要 Disclosed herein is a technique for created an advanced MRAM array for constructing a memory integrated circuit chip. More specifically, the disclosed principles provide for an integrated circuit memory chip comprised of a combination of at least one of an array of high-speed magnetic memory cells, and at least one of an array of high-density magnetic memory cells. Accordingly, a memory chip constructed as disclosed herein provides the benefit of both high-speed and high-density memory cells on the same memory chip. As a result, applications benefiting from the use of (or perhaps even needing) high-speed memory cells are provided by the memory cells in the high-speed memory cell array.
申请公布号 US2008186757(A1) 申请公布日期 2008.08.07
申请号 US20070743453 申请日期 2007.05.02
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIN WEN-CHIN;CHENG HSU-CHEN;WANG YU-JEN;TANG DENNY
分类号 G11C11/00 主分类号 G11C11/00
代理机构 代理人
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