PRODUCTION PROCESS OF PRINTED CIRCUITS ON WHICH ELECTRONIC COMPONENTS WITHOUT LEADING WIRE ARE SOLDERED.

摘要

The present patent application relates to a production process of printed circuits on which electronic components without leading wire situated on the opposite side with respect to the circuit printed side are soldered. In particular, the said process provides for drilling the support (10), rolling it with a layer of conductive material (20) on only one (10a) of the two sides (10a and 10b) and making the circuits on the said side (10a).