发明名称 COPPER FOIL LAMINATE AND METHOD FOR TREATING SURFACE OF COPPER FOIL
摘要 PROBLEM TO BE SOLVED: To provide a copper foil laminate which can improve reliability of electronic devices by increasing adhesive force between a copper foil and an insulating material, and a method for treating a surface of a copper foil. SOLUTION: For the purpose of improving an adhesive force to an insulating material, a mixed silane coupling agent comprising a silane coupling agent containing a group having an amino functional group and a silane coupling agent containing a group having a glycydoxy functional group is coated on a surface of a copper foil 1 as an upper layer for increasing an adhesive force, whereby a synergy effect by using the mixed coupling agent can be made into maximum without being influenced by the characteristics (basiticy or acidity) of a reaction group on a surface of the insulating material to give an improved adhesive force between the insulating material and the copper foil. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008179127(A) 申请公布日期 2008.08.07
申请号 JP20070303111 申请日期 2007.11.22
申请人 LS CABLE LTD 发明人 KIM SEUNG MIN;KIM SANG GYUM;CHOI SEUNG JUN;CHAE YOUNG WOOK
分类号 B32B15/08;B32B15/01;C23C28/00;C25D7/06;H05K3/38 主分类号 B32B15/08
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