| 摘要 |
A method of protecting front surface structure of a wafer and method of wafer dividing is provided. Initially, a wafer having a plurality of device disposed on a front surface thereof is provided. A protective layer is formed on the front surface of the wafer and a first bonding layer is provided to bond the wafer to a carrier. Subsequently, a wafer dividing process is performed to form a plurality of dies. After that, the first bonding layer and the protective layer are removed to separate the dies individually.
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