| 摘要 |
<p>A cooling device including a core with a plurality of twin fins connected with a plurality of grooves on the core is disclosed. Each twin fin includes a root and a pair of vanes extending from the root. Each root is connected with one of the grooves to mount the twin fins to the core. The core can be made from a high thermal conductivity material such as copper (Cu) or graphite so that heat conducted from a component in thermal communication with the core can be conducted upward into the core and spread out through the twin fins thereby reducing heat flux concentration. Heat dissipation from the core can be increased by increasing the number of grooves and twin fins, by increasing an area of the twin fins, and by reducing a thermal resistance of a means for connecting the root of the twin fins with the grooves.</p> |
