WIRE ELECTRICAL DISCHARGE MACHINING METHOD, SEMICONDUCTOR WAFER MANUFACTURING METHOD AND SOLAR BATTERY CELL MANUFACTURING METHOD

摘要

Provided are a wire electric discharge machining method for a poorly conductive material such as solar cell silicon, and a semiconductor wafer manufacturing method and a solar battery cell manufacturing method based on such a wire electric discharge machining method. Electrical discharge machining of high volume resistivity hard and brittle materials having a volume resistivity that is equal to or higher than 0.5 ©·cm and equal to or lower than 5 ©·cm is performed by applying a pulse voltage having a pulse width that is equal to or higher than 1 µsec and equal to or lower than 4 µsec and having a peak current at the time of machining on a wire electrode that is equal to or higher than 10 A and equal to or lower than 50 A to a wire electrode and generating a discharge pulse between the wire electrode and a subject to be machined.