发明名称 APPARATUS AND METHOD FOR TREATING SUBSTRATE
摘要 A method and an apparatus for treating a substrate are provided to improve a process efficiency of the substrate treating apparatus by effectively removing organic pollutants from a substrate surface during a peeling process. A substrate treating apparatus includes a peeling unit(120), a rinsing unit(130), a drying unit(140), and a UV(Ultra-Violet) cleaning unit(150). The peeling unit supplies a peeling solution on a substrate to peel off pollutants from a substrate surface. The rinsing unit rinses off the peeling solution, which remains on the substrate surface. The drying unit sprays a drying gas on the substrate to dry the substrate. The UV cleaning unit irradiates a UV ray on the substrate surface. The peeling unit, the rinsing unit, the drying unit, and the UV cleaning unit sequentially process the substrate.
申请公布号 KR20080071676(A) 申请公布日期 2008.08.05
申请号 KR20070009832 申请日期 2007.01.31
申请人 SEMES CO., LTD. 发明人 YU, EUN SEOK;KANG, SUNG YOUL;LEE, JIN SEOK
分类号 H01L21/304 主分类号 H01L21/304
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