FILM FOR SEALING AND SEMICONDUCTOR DEVICE USING THE SAME

摘要

Disclosed is a sealing film having a resin layer which contains the component (A), (B) and (C) described below and has a flow amount at 80°C of 150-1800 µm. The sealing film is excellent in fillability and adhesion. Also disclosed are a method for producing such a sealing film, and a semiconductor device using such a sealing film. (A) a resin component containing a polymer component (a1) containing a crosslinkable functional group and having a weight average molecular weight of not less than 100,000 and a Tg within the range from -50°C to 50°C, and a thermosetting component (a2) mainly composed of an epoxy resin (B) a filler having an average particle diameter of 1-30 µm (C) a coloring agent Also disclosed is a sealing film having a resin layer which contains the above-described component (A), (B) and (C) and has a viscosity at 50-100°C as determined by thermosetting viscoelasticity measurement of the film in the stage B of 10,000-100,000 Pa s. This sealing film is excellent in adhesion and shape retention characteristics. A semiconductor device using such a sealing film is further disclosed.