| 摘要 |
Provided is a cooling apparatus for a semiconductor device. The apparatus includes: a main body capable of moving vertically to face the semiconductor device that is mounted on a test unit in order to perform an electrical test; a heat exchange unit combined with the main body and contacting a top surface of the semiconductor device to absorb heat generated by the semiconductor device; and a lift unit combined with the main body and for moving the main body vertically. The heat exchange unit is combined with the main body to be capable of rotating according to an angle by which the semiconductor device is tilted when the heat exchange unit contacts the semiconductor device.
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