| 摘要 |
A contact probe and a socket for testing semiconductor chips are provided with a simple structure, so that they can be easily manufactured, and can reduce a signal path not only to improve test reliability but also remarkably reduce the dimensions of test equipment. The contact probe comprises: a nonconductive elastic plate having main through-holes corresponding to contact terminals of a test target; plungers coupled on upper sides of the main through-holes, each having a plunger head that is elastically supported by the elastic plate and a plunger body that extends downwards from the center of the plunger head; and contact pins coupled on lower sides of the main through-holes, each having a receiving hole contacting the plunger body of each plunger at a center thereof. Thus, the contact probe employs a simple structure capable of coupling the plungers to the nonconductive elastic plate and elastically supporting the plungers, so that they can be easily manufactured, improve the signal pass of test electric current to secure test reliability, and be manufactured at a subminiature size suitable for equipment for testing semiconductor chips, which are gradually becoming complicated due to technical development.
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