| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film in which adhesion to gold, silver, copper, nickel and paladium, which are adhesion resistant metal materials used on a surface of a lead frame, and preservability of the adhesive film are both realized and which bonds a semiconductor element and a support member, and to provide a semiconductor device using the adhesive film. SOLUTION: The adhesive film used for bonding the semiconductor element and the support member is constituted of a resin composition comprising thermoplastics and polysulfide silane coupling agent. COPYRIGHT: (C)2008,JPO&INPIT |
