| 摘要 |
There is provided an LED package. An LED package according to an aspect of the invention includes a package body including a concave part formed as a mounting section, first and second lead frames mounted to the package body to be exposed at a lower surface of the concave part, an LED chip mounted to the lower surface of the concave part to be electrically connected to the first and second lead frames, and an encapsulant formed by mixing transparent resin and a phosphor and formed inside the concave part to encapsulate the LED chip. Here, a height from an upper surface of the LED chip and an upper surface of the encapsulant is 1 to 5 times larger than that of the LED chip.
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