发明名称 HOUSING TAPE FOR CHIP TYPE ELECTRONIC COMPONENT, AND MANUFACTURING METHOD FOR TAPING ELECTRONIC COMPONENT TRAIN
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a housing tape for a chip type electronic component which surely performs thermo-compression bonding of a cover tape, and at the same time, can easily and surely separate the cover tape when the chip type electronic component is taken out, is excellent in housing property and taking-out property of the chip type electronic component, and also, is economical, and to provide a taping electronic component train using the housing tape, and its manufacturing method. <P>SOLUTION: A tape main body 20 is formed by bonding a first tape member 11 equipped with a housing hole 21 on one main surface, and a second tape member 12 having a fitting recessed section 12a in which the first tape member 11 is fitted. The opening section 21a of the housing hole 21 is sealed by thermo-compression bonding the cover tape 22 on the one main surface 11a of the first tape member 11. As the first tape member, one having a smaller surface roughness compared with the second tape member is used. Also, as the first tape member, one consisting of a virgin pulp material is used, and as the second tape member, one consisting of a recycled paper is used. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008174252(A) 申请公布日期 2008.07.31
申请号 JP20070007985 申请日期 2007.01.17
申请人 MURATA MFG CO LTD 发明人 FUKUDA KENICHI
分类号 B65D73/02;B65B15/04;B65D85/86 主分类号 B65D73/02
代理机构 代理人
主权项
地址