SECOND SURFACE METALLIZATION

摘要

A process for selectively metallizing a transparent or translucent non-conductive substrate including the steps of 1) masking at least a portion of the front surface of the non- conductive substrate with a peelable coversheet; 2) conditioning and activating the non- conductive substrate to accept metal plating thereon; 3) removing the peelable coversheet; and 4) plating the non-conductive substrate. Thus, the portion of the non-conductive substrate masked by the peelable coversheet remains unplated such that the metal plate can be viewed through the front surface of the substrate. The non-conductive substrate may be a three- dimensional molded substrate produced from a molded plastic film.