| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable package-on-package type semiconductor device where functional elements are arranged three-dimensionally at low costs by utilizing an existing infrastructure. <P>SOLUTION: In the package-on-package type semiconductor device where a plurality of layers of packages in which a semiconductor chip 5 is mounted are laminated on a thin-type printed-wiring board 13, a polymeric film is used as an insulating layer of the thin-type printed-wiring board, where the glass transition temperature is not less than 300°C, tensile elastic modulus is 5-20 GPa, coefficient of linear expansion is -3 to +8 ppm/°C, and thickness is 2.5-40 μm. <P>COPYRIGHT: (C)2008,JPO&INPIT |
