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发明名称
Verfahren für die Montage eines Halbleiterchips auf einem Substrat.
摘要
申请公布号
CH697279(B1)
申请公布日期
2008.07.31
申请号
CH20040002014
申请日期
2004.12.06
申请人
OERLIKON ASSEMBLY EQUIPMENT AG, STEINHAUSEN
发明人
URBEN MATTHIAS
分类号
H01L21/58
主分类号
H01L21/58
代理机构
代理人
主权项
地址
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