MOLDING DIE FOR RESIN SEALING, SEMICONDUCTOR DEVICE USING THE SAME, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To prevent the occurrence of a resin residue that causes deterioration in dimensional accuracy while preventing the occurrence of deformation during resin sealing even if a bonding wire is used. SOLUTION: A molding die for resin sealing is composed as follows. An upper die 5, having a recessed part 11 forming a cavity 6 in-between a lower die 4, has a gate 7 that is opened in the bottom face of the recessed part 11. The end part of the gate 7 part cylindrically protrudes to the lower die 4 side from the bottom face of the recessed part 11. COPYRIGHT: (C)2008,JPO&INPIT