| 发明名称 |
ADHESIVE SHEET FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE USING IT |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor devices of high reliability with improved heat resistance and without changing established producing process, and also to provide an adhesive sheet used for this method, and semiconductor devices obtained by this method. <P>SOLUTION: The adhesive sheets 10 and 12 for semiconductor devices are used for pasting semiconductor elements to a pasting object to preform wire bonding to the semiconductor elements, and contain a lipophilic layered clay mineral. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2008177550(A) |
申请公布日期 |
2008.07.31 |
| 申请号 |
JP20070318447 |
申请日期 |
2007.12.10 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
AMANO YASUHIRO;TERADA YOSHIO;TAKAMOTO HISAHIDE |
| 分类号 |
H01L21/52;C09J7/02;C09J11/04;C09J11/06;C09J133/00;C09J161/06;C09J163/00;C09J201/00;H01L21/60;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/52 |
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