| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a retainer ring for a polishing head which uniformly polishes the whole of a wafer, allows recycling and reduces an amount of waste resin to the minimum. <P>SOLUTION: The retainer ring includes a base portion 9A which is made of a highly rigid material in a ring shape and is supported on the polishing head side, and a resin portion 9B which has a plurality of resin blocks 9b attached at almost the same interval on the undersurface of the base portion 9A and forms the contact side to a polishing pad. Gaps between adjacent resin blocks 9b and the undersurface of the base portion 9A form slurry channels 18. <P>COPYRIGHT: (C)2008,JPO&INPIT |
