| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a reliable high-density packaging semiconductor package where functional elements are arranged three-dimensionally at low costs by utilizing an existing infrastructure. <P>SOLUTION: In the laminated type semiconductor package where a plurality of semiconductor chips 5 and an interposer 6 are laminated and electrical connection is performed by wire bonding, a polyimide film is used as a spacer, where polyimide film has a glass transition temperature not less than 300°C, a 5-20 GPa tensile elastic modulus, and a -3 to +8 ppm/°C coefficient of linear expansion. <P>COPYRIGHT: (C)2008,JPO&INPIT |
