| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a liquid solvent abutment unit which promotes a reaction of a bonding member by a liquid solvent between a perforated support plate and a wafer. <P>SOLUTION: The liquid solvent abutment unit is constituted of: a supply part (103) for supplying the liquid solvent onto a support plate face; a staying part (10) for staying the supplied liquid solvent in a hole forming range on the support plate face; a recovery part (104) for recovering the liquid solvent staying in the hole forming range; and a vibration part (13) for vibrating the liquid solvent. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
