| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heating apparatus, or the like, that uniformly heats the whole substrate by reducing the effect of an initial temperature distribution generated on a substrate surface, when the substrate is carried into a heating chamber. <P>SOLUTION: The heating apparatus has the heating chamber 3 generating the initial temperature distribution on the substrate surface, when the substrate (wafer W) is carried in. A temperature-distribution imparting means (heating lamp 2) imparts a temperature distribution before a carrying-in so as to relax the initial temperature distribution on the surface of the substrate, before the substrate is carried into the heating chamber 3, i.e., it is present at a standby place (cooling plate 4). <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
