| 摘要 |
PROBLEM TO BE SOLVED: To provide a flexible board improved in a discharge effect of bubbles from inside to outside of a semiconductor chip mount region, and also to provide a semiconductor device having the flexible board. SOLUTION: The flexible board 101 comprises: a base material 100 having the semiconductor chip mount region 103 on one surface; a plurality of inner leads 106 formed on that surface; and jumper wiring 111 connected to two of the plurality of inner leads 106. A first wiring section 121 in the jumper wiring 111 crosses the semiconductor chip mount region 103, thus improving a discharge effect of bubbles from inside to outside of the semiconductor chip mount region 103. COPYRIGHT: (C)2008,JPO&INPIT |
