| 发明名称 |
SOLDER ALLOYS AND METHOD FOR THE REPAIR OF A COMPONENT |
| 摘要 |
Many known solder alloys according to prior art utilize silicon or boron as melting point reducers, which, however, form brittle phases that have an undesirable effect on the thermo-mechanical properties. The solder alloy comprises gallium and/or germanium, preferably forming the Y' phase and having improved mechanical properties. |
| 申请公布号 |
WO2008110454(A1) |
申请公布日期 |
2008.09.18 |
| 申请号 |
WO2008EP52324 |
申请日期 |
2008.02.26 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT;MTU AERO ENGINES GMBH;HEINZ, PAUL;SINGER, ROBERT |
发明人 |
HEINZ, PAUL;SINGER, ROBERT |
| 分类号 |
B23K35/30;B23K1/00;C22C19/00 |
主分类号 |
B23K35/30 |
| 代理机构 |
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代理人 |
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