发明名称 |
FLIP CHIP INTERCONNECTION USING NO-CLEAN FLUX |
摘要 |
A flip chip method of joining a chip and a substrate is described. A thermo-compression bonder is utilized to align the chip and substrate and apply a contact force to hold solder bumps on the substrate against metal bumps on the chip. The chip is rapidly heated from its non-native side by a pulse heater in the head of the bonder until the re-flow temperature of the solder bumps is reached. Proximate with reaching the re-flow temperature at the solder bumps, the contact force is released. The solder is held above its re-flow temperature for several seconds to facilitate wetting of the substrate's metal protrusions and joining. A no-clean flux that has a volatilization temperature below the melting point of the solder bumps is utilized to minimize or eliminate the need for a post interconnection de-flux operation. |
申请公布号 |
EP1374297(B1) |
申请公布日期 |
2008.07.30 |
申请号 |
EP20020717699 |
申请日期 |
2002.03.22 |
申请人 |
INTEL CORPORATION |
发明人 |
TAKAHASHI, KENJI;MAEDA, MICHIHISA |
分类号 |
H01L21/60;B23K35/26;B23K35/36;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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