Connector applied underfill

摘要

Processes for reliably and durably mounting a connector body to a surface of a circuit board without using conventional underfill and overmolding techniques are provided. These processes involve preparation of a self adhering connector subassembly (30) comprising a connector body (12) and an activatable solid adhesive (24) disposed on a mounting surface (32) of the connector body (12), positioning of the subassembly (30) on a circuit board, and activation of the adhesive (24) to securely attach the connector body (12) to the circuit board. The activable solid adhesive (24) has a pattern of openings in which the solder balls (18) project.