发明名称
摘要 A method of enhancing the heat dissipating properties of a rigid substrate plate through creation of an array of erect spaced-apart parallelly disposed metallic fins projecting from the heat dissipating surface of the plate. The fins are created by superimposing a sheet of metallic foil upon a metallic plate, with the foil being bonded to the plate by welding utilizing ultrasonic energy. The welds are formed as spaced-apart parallel bands, with the foil being slit adjacent one edge of the band, with the foil thereafter being folded outwardly to form the heat dissipating metallic foil fins. The folding operation is undertaken following the steps of populating the substrate, thereby eliminating the requirement for unusual steps or precautions to protect what otherwise would be outwardly extending metallic fins.
申请公布号 JP4128490(B2) 申请公布日期 2008.07.30
申请号 JP20030170538 申请日期 2003.06.16
申请人 发明人
分类号 H01L23/36;B23K20/10;F28F3/02;H01L21/48;H01L23/367 主分类号 H01L23/36
代理机构 代理人
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