发明名称 Ball grid array assignment
摘要 A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in first ordered channels of adjacent transmitter differential pairs. High speed receiver contacts are disposed in a second portion of the pattern, where the first portion of the pattern is not interspersed with the second portion of the pattern, and the high speed receiver contacts are disposed in first ordered channels of adjacent receiver differential pairs. At least one unbroken line of other contacts is disposed between the first portion of the pattern and the second portion of the pattern, where the other contacts do not contain any high speed transmitter contacts and high speed receiver contacts. Low speed IO contacts are disposed in a third portion of the pattern. The first ordered channels are ordered to match an order of transmitter channels of a connector or another component on a printed circuit board to which the transmitter differential pairs are routed, and the second ordered channels are ordered to match an order of receiver channels of a connector or another component on a printed circuit board to which the receiver differential pairs are routed.
申请公布号 US7405946(B2) 申请公布日期 2008.07.29
申请号 US20050122370 申请日期 2005.05.05
申请人 LSI LOGIC CORPORATION 发明人 HALL JEFFREY A.;GHAHGHAHI FARSHAD
分类号 H05K7/00 主分类号 H05K7/00
代理机构 代理人
主权项
地址