INSERT APPARATUS OF SEMICONDUCTOR PACKAGE

摘要

A semiconductor package insert device is provided to prevent a semiconductor package and a pusher from being damaged by stably positioning a groove of the semiconductor package in the semiconductor package. A semiconductor package insert device includes a package insert(100), a latch(130), and a latch open cover(200). A guide groove(120) is formed in the package insert and guides a guide post(410) of a pusher unit(400). The latch is rotatively installed based on a hinge pin. The latch open cover opens the latch. A pair of first side package guides(140a,140b) are rotatively installed based on the hinge pin. An interval between the first side package guide and the second side package guide is greater than a width of a semiconductor package(300). An interval between lower ends(142a) corresponding to the width of the semiconductor package.