| 摘要 |
a method of manufacturing a semiconductor device including (1) providing a metal plate having an upper surface and a back surface, the metal plate including a plurality of lids disposed in matrix, which are defined by a first groove formed from the upper surface, (2) providing a ceramic sheet having an upper surface and a back surface, the ceramic sheet including a plurality of headers disposed in matrix, which are defined by a second groove formed from the back surface, (3) fixing the metal plate on the ceramic sheet by facing the back surface of the onto metal plate to the upper surface of the ceramic sheet, wherein the first groove is aligned with the second groove, and (4) dividing the metal plate and the ceramic sheet along the first and the second grooves.
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