| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device package having improved electrical and physical reliability. <P>SOLUTION: A semiconductor device package comprises a first bump sequence comprising a plurality of first bumps arranged on an active surface of a semiconductor device to be separated from an outer edge of the semiconductor device by a first distance, a second bump sequence comprising a plurality of second bumps arranged on the active surface of the semiconductor device to be separated from an outer edge of the semiconductor device by a second distance longer than the first distance, and a third bump sequence comprising a plurality of third bumps arranged on the active surface of the semiconductor device to be separated from an outer edge of the semiconductor device by a third distance longer than the second distance. Between each adjacent first bump, there are sequences in which one of the second bumps and one of the third bumps are arranged alternately at least 2 times or more. <P>COPYRIGHT: (C)2008,JPO&INPIT |
