摘要 |
PROBLEM TO BE SOLVED: To provide a mold and the like, which can alleviate or suppress curing of a photo-curing resin in an area where such curing is not intended. SOLUTION: The mold is equipped with an uneven patterned processing surface, a rear surface opposing the processing surface and a non-patterned section without the uneven pattern, wherein a shielding to reduce a light irradiated through a side is prepared on the side of the mold constituting the non-patterned section; provided that the mold is used in an imprint apparatus which processes a processing object by shaping a photo-curing processing object into a uneven pattern reversed to that of the uneven pattern of the mold, and irradiating the light to cure the processing object through the mold. COPYRIGHT: (C)2008,JPO&INPIT |