| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy material for a fuse, which has improved pre-arcing time-current characteristics. SOLUTION: The copper alloy material provided with a plating film comprises: a copper alloy substrate 1; an Ni layer 2 formed on the surface thereof; an alloy layer 3 containing Ni and Sn formed thereon, which is formed from an Ni-Sn alloy, an Ni-Cu-Sn alloy or both of them; and a pure Sn layer 4 formed thereon as the outermost surface layer. The copper alloy substrate 1 comprises, 0.1 to 1 mass% Ni, 0.1 to 1 mass% Sn, 0.01 to 0.2 mass% P, and the balance Cu with unavoidable impurities. The Ni layer 2 has a thickness of 0 to 10μm, the alloy layer 3 containing Ni and Sn has a thickness of 0.01 to 50μm, and the pure Sn layer 4 has a thickness of 0.1μm or more. The manufacturing method comprises the steps of plating the surface of the copper alloy substrate with Ni and subsequently with Sn, and then subjecting the resultant substrate to reflow treatment or heat treatment; or the steps of plating the surface of the copper alloy substrate with Ni, and then hot-dip-plating the Ni-plated surface with Sn. COPYRIGHT: (C)2008,JPO&INPIT
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