| 摘要 |
PROBLEM TO BE SOLVED: To provide a thin-film capacitor mounting wiring substrate wherein a semiconductor chip is mounted close to a capacitor, and the substrate is manufactured at low cost, and to provide its manufacturing method. SOLUTION: In the thin-film capacitor mounting substrate, the thin-film capacitor including at least a dielectric layer B between a metal layer A and a metal layer C is laminated on the wiring substrate through an adhesion layer so that the metal layer A may become an outer surface, and the thin-film capacitor and an outermost layer of the wiring substrate are covered by a solder resist layer except a portion used as a terminal. The thin-film capacitor includes an opening X which exposes the metal layer C to the metal layer A and the dielectric layer B, and the solder resist layer includes an opening Y which covers an inside face of the opening X, and forms an exposed face of the metal layer C as the terminal. COPYRIGHT: (C)2008,JPO&INPIT
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